Meyer Burger has successfully concluded a contract of over CHF 55 million with a customer in Asia. The contract includes slicing, bricking, and automated gluing systems from MB Wafertec (Meyer Burger Ltd) and wafer inspection systems from Hennecke Systems GmbH. The equipment is scheduled to be delivered during 2011.
Meyer Burger Technology Ltd (SIX Swiss Exchange: MBTN) announced today that the group members MB Wafertec (Meyer Burger Ltd) and Hennecke Systems GmbH succeeded in concluding a contract of over CHF 55 million with a customer in Asia. The contract includes slicing, bricking and automated gluing systems from MB Wafertec (Meyer Burger Ltd) as well as wafer inspection systems from Hennecke Systems GmbH. The advanced manufacturing equipment will secure the production of high quality solar wafers and is scheduled to be delivered during 2011.
Further information:
Werner Buchholz
Head of Corporate Communications
Tel +41 (0) 33 439 05 06
w.buchholz@meyerburger.ch
