Having recently celebrated two decades of innovation in the thermal technology arena, the team at Rehm Thermal Systems is preparing to mark the occasion with a series of Technology Days in Blaubeuren-Seißen. Open to anyone with an interest in how the company’s thermal technologies could transform their electronics or photovoltaic production processes, the events will be held over October 7th – 8th 2010.
Delivering an engaging programme of events, the Rehm Technology Days will feature specialist seminars on a wide range of topical industry issues, an exhibition of leading-edge technologies supported by partner companies and a fully functioning SMD line. The event will include presentations such as ‘Causes of Assembly Group Failures’ by Weptech’s Oswald Maurer, ‘Multifunctional Convection Soldering Systems’ by Rehm’s Dr. Hans Bell, ‘Backside Reflow Soldering’ by Endress & Hauser’s Dietmar Birgel, ‘New Developments in Silicon Photovoltaics’ by Fraunhofer ISE’s Dr. Daniel Biro and ‘Advantages and drawbacks of immersion-tin surfaces’ by TechnoLab’s Lutz Bruderreck.
Commenting on the forthcoming technology days, Rehm Thermal Systems CEO, Johannes Rehm, explains: “The past two decades have seen us grow from our origins as a two-man company working out of 45 square metres, to a global force in electronics and solar energy with factories in Germany, China and Russia.
