“InCellPlate Cu” from TIER ONE Cell producer
Gütenbach, May 23th, 2016: RENA Technologies GmbH is pleased to announce the first order for its new high-end copper plating technology “InCellPlate Cu” from an international TIER One solar cell producer. Our customer is a global leader in the solar industry based in China and manufactures best-in class Si-wafers, Si-cells and modules. This order is the first step into a new generation of solar cell production for our customer as well as for RENA Technologies GmbH. As a first step RENA will deliver one “InCellPlate Cu” pilot tool. After successful testing line expansion and production ramp-up using this new technology is scheduled.
RENA`s copper plating technology solution combines laser induced ablation of the silicon nitride layer, plating of the metal electrodes and subsequent inline anneal. This provides complete front-side metallization for solar cell manufacturing. The “InCellPlate Cu” product makes the use of screenprinted silver paste on the front side obsolete. It further replaces the precious metal silver with cheaper copper as a conductive material. The RENA patented technology allows single side plating of the cell’s sunny side while keeping the rear-side dry. Compared with screen-printing, the technology reduces the cell production cost by up to 6$ct/cell and at the same time offers potential for efficiency improvement: direct plating allows the formation of thin fingers and contact formation to emitters with low surface doping, thus enabling higher short circuit currents and open circuit voltages while keeping the fill factor on a high level.
