Two existing PV customers located in Asia and in Europe have contracted Meyer Burger for the delivery and installation of its industry leading newest generation DW288 Series 3 diamond wire saws. The total contract volume is around CHF 15 million.
Meyer Burger Technology Ltd (SIX Swiss Exchange: MBTN) today announced that it has concluded two further significant contracts for its industry leading DW288 Series 3 diamond wire cutting platform. Two existing PV customers in Asia and Europe have chosen Meyer Burger’s award-winning diamond wire cutting technology in order to increase their production volume of high quality solar wafers.
The total value of the two contracts is around CHF 15 million. Delivery and installation of the diamond wire saw platforms are planned by the end of 2016.
The newest DW288 Series 3 diamond wire saw is based on Meyer Burger‘s proven environmentally friendly water-based industrialized diamond wire cutting technology and enables Meyer Burger’s customers to sustainably reduce their manufacturing costs for solar wafers. With the market success of its pioneering diamond wire cutting technology, Meyer Burger continues to increase its share of the growing mono-crystalline slicon wafer market.
