Laser for advanced ceramic cutting / dicing and PCB drilling InnoLas Systems picosecond laser tool enables innovative ceramics processing
InnoLas Systems has many years of experience with ultra short pulse lasers, cutting of brittle material (solar cells, glass, sapphire) and precision micro machining. The know-how from all three sectors and the already existing long time experience in the ceramic business is now combined in the InnoLas ILS 500X and ILS 500XX systems, which use an ultra short pulse laser for the cutting, drilling and dicing of ceramics and PCBs. As one of the world’s leading manufacturers of laser machining systems for glass and crystalline solar cells, InnoLas Systems has extensive experience in laser processing of brittle materials. The company now applies this know-how to ceramics for electronics and other high-tech applications. Many advanced electronic components are based on ceramic, which offers a number of advantages as a substrate material. However, being a brittle material, ceramic is difficult to cut or drill. Conventional laser cutting or scribing is based on rapid heating, leading to vaporization or melting of the material. This process is not only slow, but also has an inherent risk of micro-cracks and chip-outs that can lead to a low yield. InnoLas laser cutting employs ultra short pulse (picoseconds) lasers to cut brittle materials. This technique has demonstrated perfect yield at very high quality, and it allows cutting features, holes, chamfers, and more, in ceramics.
The ILS 500X/500XX platform can be equipped with fixed or flying scanner optics to guarantee highest positioning accuracy. 355, 532 and 1064nm laser wavelengths and beam shaping are available to fine-tune the system to given application requirements. In addition, the workstation can also be combined with CO2 lasers for conventional scribing. For high volume production lines, the ILS 500X/500XX laser station can be fitted with InnoLas Systems or third party handling systems for automatic loading/unloading of the work pieces.
Richard Grundmüller, CEO InnoLas: “InnoLas Systems has more than ten years of experience in laser processing of crystalline solar cells. We have now applied this know-how to ceramics cutting and drilling. Our InnoLas ILS 500X system with ultra short pulse lasers demonstrates a much higher yield process than presently available with other laser cutting methods. The system can cut features, chamfers and holes without chip-outs or micro-cracks.”
About InnoLas Systems
GmbH
InnoLas Systems GmbH produces laser systems for micro material processing,
particularly in the photovoltaic industry, for semiconductors, electronics
and precision engineering. InnoLas Systems designs and manufactures
machinery solutions as stand-alone systems or for inline integration,
perfectly adapted to industrial production conditions. Worldwide service and
support ensures smooth setup and reliable operation. InnoLas Systems
utilizes innovations in laser technology to produce highly-efficient and
reliable processing systems.
Reader inquiries:
InnoLas Systems GmbH
Robert-Stirling-Ring 2
82152 Krailling
Germany
Tel: +49 89 899 4828-0
Email: info@innolas-systems.com
