DELAWARE, OH – September 2015 – Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar silicon solar modules.
EMS 561-403 is designed to be used in a modified ribbon stringer. The material will snap cure and fixture ribbons in seconds at 180°C with enough strength to withstand module manufacturing processes until the adhesive cure is completed during the encapsulant lamination process. EMS 561-403 can be dispensed by time-pressure, auger or jetting. The adhesive is more stress absorbing than solder to withstand the rigors of thermal cycling and processes at lower temperatures than solder. EMS 561-403 is more than 50 percent less expensive than pure silver filled conductive adhesives.
