Meyer Burger has successfully concluded a contract of over CHF 70 million for wire saws and wafer inspection systems with a customer in Asia. The customer plans the expansion of its production facility in 2011, and relies on the high-tech manufacturing equipment from Meyer Burger. The equipment is scheduled to be delivered during 2011.
Meyer Burger Technology Ltd (SIX Swiss Exchange: MBTN) announced today that the group members MB Wafertec (Meyer Burger Ltd) and Hennecke (Hennecke Systems GmbH) succeeded in concluding another important contract for the supply of wire saws and wafer inspection systems with a customer in Asia. The customer plans an expansion of its production capacity in 2011. The wire saws from MB Wafertec and the inspection systems of Hennecke will secure the manufacturing of high quality solar wafers. The equipment is scheduled to be delivered during 2011.
