Engineered Material Systems, a leading global supplier of conductive interconnect materials for photovoltaic applications, will introduce its new 561-147 Snap Cure Conductive Adhesive in Hall 1, Booth E19 at EU PVSEC, scheduled to take place Sept. 23-25, 2014 at the RAI Convention & Exhibition Centre in Amsterdam. The low-cost adhesive is ideal for Heterojunction (HIT) silicon solar modules.
EMS 561-147 is designed to be used in a modified ribbon stringer. The material will snap cure and fixture ribbons in seconds at 180°C with enough strength to withstand module manufacturing processes until the adhesive cure is completed during the encapsulant lamination. EMS 561-147 can be dispensed by time pressure, auger or jetting. The adhesive is more stress absorbing than solder to withstand the rigors of thermal cycling and processes at lower temperatures than solder. EMS 561-147 is 60 percent more cost effective than pure silver filled conductive adhesives.
EMS 561-147 is the latest addition to Engineered Materials Systems’ full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon and thin-film photovoltaic applications.
For more information about the EMS 561-147 Low-Cost
Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.
